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| MUR550APF, MURD550PF, MUR550PF Preferred Device SWITCHMODEt Power Rectifier These state-of-the-art devices are designed for power factor correction in discontinuous and critical conduction mode. Features http://onsemi.com * * * * * * 520 V Rating Meets 80% Derating Requirements of Major OEMs Low Forward Voltage Drop Low Leakage Ultrafast 95 Nanosecond Recovery Time Reduces Forward Conduction Loss Pb-Free Packages are Available ULTRAFAST RECTIFIER 5.0 AMPERES, 520 VOLTS MARKING DIAGRAMS Applications AXIAL LEAD CASE 267 STYLE 1 * DCM PFC Designs * Switching Power Supplies * Power Inverters Mechanical Characteristics: * Case: Epoxy, Molded * Epoxy Meets UL 94 V-0 @ 0.125 in * Weight: MUR550APF: 1.1 Gram (Approximately) * * MURD550PF: 0.4 Gram (Approximately) MUR550PF: 1.9 Gram (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 220C Max. for 10 Seconds 12 3 A MUR 550APF YYWW G G 4 1 DPAK CASE 369C YWW U 550G 4 3 Pin 1: No Connect 4 TO-220AC CASE 221B PLASTIC 1 4 AY WWG MUR550PF KA 1 3 3 A = Assembly Location YY, Y = Year WW = Work Week G or G = Pb-Free Package KA = Diode Polarity (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 1 February, 2006 - Rev. 2 Publication Order Number: MUR550/D MUR550APF, MURD550PF, MUR550PF MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR) TC = 65C (Rated VR) TC = 160C Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) MUR550APF MURD550PF, MUR550PF IFSM MUR550APF MURD550PF MUR550PF TJ Tstg ESD > 400 >8000 85 75 100 -65 to +175 -65 to +175 C C V A Symbol VRRM VRWM VR IF(AV) Value 520 Unit V 5.0 A Operating Junction Temperature Range Storage Temperature Range ESD Ratings: Machine Model = C Human Body Model = 3B Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction-to-Case (Note 1) MURD550PF, MUR550PF Thermal Resistance, Junction-to-Ambient MUR550APF MURD550PF (Note 3) 1. Rating applies when surface mounted on the minimum pad sizes recommended. 2. See Note 2, Ambient Mounting Data. 3. 1 inch square pad size on FR4 board. Symbol RqJC RqJA Value 2.8 C/W Note 2 62 Unit C/W ELECTRICAL CHARACTERISTICS Rating Maximum Instantaneous Forward Voltage Drop (Note 4) (IF = 5.0 A, TJ = 25C) (IF = 5.0 A, TJ = 150C) Maximum Instantaneous Reverse Current (Note 4) (VR = 520 V, TJ = 25C) (VR = 520 V, TJ = 150C) Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms, VR = 30 V, TJ = 25C) 4. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. Symbol VF 1.15 0.98 IR 5.0 400 trr 95 ns mA Value Unit V http://onsemi.com 2 MUR550APF, MURD550PF, MUR550PF NOTE 2 -- AMBIENT MOUNTING DATA Data shown for thermal resistance junction-to-ambient (RqJA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. TYPICAL VALUES FOR RqJA IN STILL AIR Mounting Method 1 2 RqJA 3 Lead Length, L (IN) 1/8 1/4 1/2 3/4 50 51 53 55 58 59 61 63 28 Units C/W C/W C/W MOUNTING METHOD 1 P.C. Board Where Available Copper Surface area is small. L L EEEEEEEEEEE EEEEEEEEEEE MOUNTING METHOD 2 Vector Push-In Terminals T-28 L L EEEEEEEEEEEE EEEEEEEEEEEE MOUNTING METHOD 3 P.C. Board with 1-1/2 x 1-1/2 Copper Surface EE EE EE EE EE EE EE EE L = 1/2 Board Ground Plane http://onsemi.com 3 MUR550APF, MURD550PF, MUR550PF iF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 100 10 10 1.0 150C 1.0 150C 125C 0.1 0 0.2 0.4 0.6 25C 0.8 1.0 1.2 1.4 1.6 125C 0.1 0 0.2 0.4 0.6 25C 0.8 1.0 1.2 1.4 1.6 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.0E-3 IR, REVERSE CURRENT (AMPS) 1.0E-4 150C IR, MAXIMUM REVERSE CURRENT (AMPS) 1.0E-3 150C 125C 1.0E-4 1.0E-5 1.0E-6 1.0E-7 1.0E-8 1.0E-9 0 25C 1.0E-5 125C 1.0E-6 1.0E-7 25C 1.0E-8 1.0E-9 0 100 200 300 400 500 100 200 300 400 500 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 4 MUR550APF, MURD550PF, MUR550PF IF, AVERAGE FORWARD CURRENT (AMPS) PFO, AVERAGE POWER DISSIPATION (WATTS) 10 dc 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 IO, AVERAGE FORWARD CURRENT (AMPS) dc SQUARE WAVE SQUARE WAVE 5 0 100 110 120 130 140 150 160 170 180 TC, CASE TEMPERATURE (C) Figure 5. Current Derating Figure 6. Forward Power Dissipation 100 C, CAPACITANCE (pF) 10 25C 1 0 50 100 150 200 VR, REVERSE VOLTAGE (VOLTS) Figure 7. Capacitance R(t), TRANSIENT THERMAL RESISTANCE 100 0.5 0.2 0.1 0.05 1 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 P(pk) t1 t2 10 DUTY CYCLE, D = t1/t2 100 1000 Figure 8. Thermal Response for MUR550APF http://onsemi.com 5 MUR550APF, MURD550PF, MUR550PF R(t), TRANSIENT THERMAL RESISTANCE 10 0.5 1 0.2 0.1 0.05 0.01 0.1 Single Pulse P(pk) t1 t2 DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 100 1000 Figure 9. Thermal Response for MURD550PF R(t), TRANSIENT THERMAL RESISTANCE 10 0.5 1 0.2 0.1 0.05 0.01 0.1 Single Pulse P(pk) t1 t2 DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 100 1000 Figure 10. Thermal Response for MUR550PF ORDERING INFORMATION Device MUR550APF MUR550APFG MUR550APFRL MUR550APFRLG MURD550PFT4 MURD550PFT4G MUR550PF MUR550PFG Package Axial* Axial* Axial* Axial* DPAK DPAK (Pb-Free) TO-220 TO-220 (Pb-Free) Shipping 500 Units/Bag 500 Units/Bag 1500 Tape & Reel 1500 Tape & Reel 2500 Tape & Reel 2500 Tape & Reel 50 Units/Rail 50 Units/Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *This package is inherently Pb-Free. http://onsemi.com 6 MUR550APF, MURD550PF, MUR550PF PACKAGE DIMENSIONS AXIAL LEAD CASE 267-05 ISSUE G K D 1 A 2 NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 267-04 OBSOLETE, NEW STANDARD 267-05. INCHES MIN MAX 0.287 0.374 0.189 0.209 0.047 0.051 1.000 --- MILLIMETERS MIN MAX 7.30 9.50 4.80 5.30 1.20 1.30 25.40 --- B K DIM A B D K STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE DPAK CASE 369C-01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 --- 0.035 0.050 0.155 --- MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 --- 0.89 1.27 3.93 --- -T- B V R 4 SEATING PLANE C E A S 1 2 3 Z U K F L D G 2 PL J H 0.13 (0.005) M T DIM A B C D E F G H J K L R S U V Z SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 3.0 0.118 SCALE 3:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MUR550APF, MURD550PF, MUR550PF PACKAGE DIMENSIONS TO-220 TWO-LEAD CASE 221B-04 ISSUE D C Q B F T S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L Q R S T U INCHES MIN MAX 0.595 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.190 0.210 0.110 0.130 0.018 0.025 0.500 0.562 0.045 0.060 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 15.11 15.75 9.65 10.29 4.06 4.82 0.64 0.89 3.61 3.73 4.83 5.33 2.79 3.30 0.46 0.64 12.70 14.27 1.14 1.52 2.54 3.04 2.04 2.79 1.14 1.39 5.97 6.48 0.000 1.27 4 A 1 3 U H K L G D J R SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 8 MUR550/D |
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